Sonam Rewari

Electronics and Communication Engineering

Phone:0
Email: rewarisonam@gmail.com

Qualifications

PhD

Areas of Interest

VLSI Design and Semiconductor Devices

Publications:

SCI/SCIE Papers: 26  

SCI/SCIE Publication Links:

1. https://www.sciencedirect.com/science/article/pii/S0749603615302913

2. https://ieeexplore.ieee.org/abstract/document/8141955

3. https://ieeexplore.ieee.org/abstract/document/8681278

4. https://link.springer.com/article/10.1007/s00339-016-0583-9

5. https://link.springer.com/article/10.1007/s00542-017-3436-3

6. https://www.sciencedirect.com/science/article/pii/S1434841119318631

7. https://link.springer.com/article/10.1007/s00542-017-3446-1

8. https://link.springer.com/article/10.1007/s11664-020-08541-9

9. https://link.springer.com/article/10.1007/s12648-020-01704-8

10. https://link.springer.com/article/10.1007/s00542-019-04577-y

11. https://link.springer.com/article/10.1007/s00339-020-03520-7

12. https://link.springer.com/article/10.1007/s00542-019-04715-6

13. https://ieeexplore.ieee.org/abstract/document/9422818

14. https://link.springer.com/article/10.1007/s12633-020-00744-3

15. https://link.springer.com/article/10.1007/s12633-021-01173-6

16. https://link.springer.com/article/10.1007/s12633-022-01663-1

17. https://link.springer.com/article/10.1007/s12633-021-01288-w

18. https://iopscience.iop.org/article/10.1088/1361-6641/ab3f02/meta

19. https://link.springer.com/article/10.1007/s11664-022-09795-1

20. https://onlinelibrary.wiley.com/doi/abs/10.1002/jnm.3065

21. https://link.springer.com/article/10.1007/s12633-021-01537-y

22. https://onlinelibrary.wiley.com/doi/abs/10.1002/jnm.2986

23. https://royalsocietypublishing.org/doi/abs/10.1098/rspa.2022.0528

24. https://link.springer.com/article/10.1007/s10825-023-02008-w

25. https://iopscience.iop.org/article/10.1088/1361-6641/acb0f3/meta

26. https://link.springer.com/article/10.1007/s13369-022-07200-x

 

Conference Papers: 22

Conference Publication Links:

1. https://ieeexplore.ieee.org/abstract/document/8770406

2. https://ieeexplore.ieee.org/abstract/document/8073979

3. https://ieeexplore.ieee.org/abstract/document/9342175

4. https://ieeexplore.ieee.org/abstract/document/7115857

5. https://ieeexplore.ieee.org/abstract/document/9358359

6. https://ieeexplore.ieee.org/abstract/document/9726743

7. https://ieeexplore.ieee.org/abstract/document/9358322

8. https://ieeexplore.ieee.org/abstract/document/9030261

9. https://ieeexplore.ieee.org/abstract/document/8770455

10. https://ieeexplore.ieee.org/abstract/document/9455919

11. https://ieeexplore.ieee.org/abstract/document/9455846

12. https://ieeexplore.ieee.org/abstract/document/7931265

13. https://ieeexplore.ieee.org/abstract/document/10032940

14. https://ieeexplore.ieee.org/abstract/document/10032917

15. https://ieeexplore.ieee.org/abstract/document/10032912

16. https://ieeexplore.ieee.org/abstract/document/10032964

17. https://ieeexplore.ieee.org/abstract/document/10040149

18. https://ieeexplore.ieee.org/abstract/document/9872837

19. https://ieeexplore.ieee.org/abstract/document/9029025

20. https://ieeexplore.ieee.org/abstract/document/8073984

21. https://ieeexplore.ieee.org/abstract/document/7514562

Last Updated : 2023-03-21 08:10:39